| 摘要 |
PROBLEM TO BE SOLVED: To provide a parallel adjusting apparatus wherein parallelism between the installation surface of a bonding stage and the holding surface of a bonding head can be easily and surely measured and adjusted. SOLUTION: The parallel adjusting apparatus adjusts tilt of either one of the installation surface 3 of the bonding stage 4 and the holding surface 12 of the bonding head 11, and sets the installation surface and the holding surface in parallel. The parallel adjusting apparatus is provided with at least a plurality of pressure detection holes which are opened and formed on a surface facing the holding surface, a vacuum pump 27 which decompresses pressure in the respective pressure detection holes, pressure sensors 24a-24d which detect differential pressure in the respective pressure detection holes when the bonding head is dropped and the holding surface of the bonding head is made to approach the surface in which the pressure detection holes are opened, and a control unit 28 which controls tilt in a horizontal direction of either one of the installation surface and the holding surface based on the pressure difference in the respective pressure detection holes which is detected by the pressure sensors. COPYRIGHT: (C)2005,JPO&NCIPI
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