发明名称 |
Particle removing apparatus in laser machining, laser scribing apparatus and method |
摘要 |
PURPOSE: A particle removing apparatus in laser machining and a laser scribing apparatus and method are provided to effectively remove scrap, dust, and gas produced during laser pattering of a substrate by sucking dust and spraying gas to a part of a patterned film. CONSTITUTION: A laser scribing apparatus comprises a laser scriber, a sucking unit(170), and a gas ejector(180). The laser scriber irradiates laser from one side of a work piece to pattern a layer formed on the other side of the work piece. The sucking unit removes dust produced during patterning of the work piece from the other side of the work piece. The gas ejector ejects gas to the processed surface of the work piece being patterned. |
申请公布号 |
KR20120013665(A) |
申请公布日期 |
2012.02.15 |
申请号 |
KR20100075789 |
申请日期 |
2010.08.06 |
申请人 |
JUSUNG ENGINEERING CO., LTD. |
发明人 |
CHO, WON TAE |
分类号 |
B23K26/364;B23K26/16;H01L31/042 |
主分类号 |
B23K26/364 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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