| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing an electronic part with an adhesive tape, by which the adhesive tape can be peeled without leaving an adhesive or the like. SOLUTION: This method for processing the electronic part, having a process for adhering an adhesive tape to the electronic part, a process for processing the adhesive tape-adhered electronic part, and a process for irradiating the processed electronic part with light to peel the adhesive tape from the processed electronic part, is characterized in that the adhesive tape has an adhesive layer containing a compound having two or more groups represented by formula (1) (R<SP>1</SP>, R<SP>2</SP>are each an alkyl, an aryl, an arylalkyl, H, or a halogen atom). COPYRIGHT: (C)2007,JPO&INPIT |
