MANUFACTURING METHOD OF PACKAGE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a package substrate which can plate a bonding pad with gold without using a plating leading line in a substrate to be used for a high-density integrated circuit package. SOLUTION: This method is a method for manufacturing a package substrate used for mounting an electric element by connecting an electrode of the electric element to the bonding pad. The method includes (a) step of manufacturing a buried pattern substrate in which a circuit pattern and the bonding pad are buried in an insulating layer and a seed layer is laminated on the surface of the insulating layer; (b) a step of laminating a dry film on the seed layer and eliminating the seed layer and the dry film on the upper surface of the bonding pad; (c) a step of executing surface treatment on the bonding pad while using the remaining seed layer as a plating leading line; and (d) a step of eliminating the remaining seed layer and the dry film so that the circuit pattern can be exposed. The manufacturing method uses an existing seed layer as the plating leading line without steps of forming and eliminating another plating leading line, thereby reducing the manufacturing process. COPYRIGHT: (C)2008,JPO&INPIT