发明名称 |
Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming outer leads having outer terminal sections, the outer terminal sections having an upper terminal and a bottom terminal; forming inner leads having inner terminal sections wider than a distance between the outer terminal sections of the outer leads, and the inner terminal sections have an upper terminal and a bottom terminal; connecting an integrated circuit to the inner leads and the outer leads; and encapsulating the integrated circuit, the inner leads, and the outer leads with an encapsulation while leaving the upper terminals and the bottom terminals of the outer terminal sections and the upper terminals and bottom terminals of the inner terminal sections exposed from the encapsulation.
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申请公布号 |
US8115287(B2) |
申请公布日期 |
2012.02.14 |
申请号 |
US20090635699 |
申请日期 |
2009.12.10 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;ADVINCULA ABELARDO JR. HADAP;SANGALANG ERWIN AGUAS;TAY LIONEL CHIEN HUI;STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;ADVINCULA ABELARDO JR. HADAP;SANGALANG ERWIN AGUAS;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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