发明名称 |
Methods for detecting defect connections between metal bumps |
摘要 |
A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.
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申请公布号 |
US8113412(B1) |
申请公布日期 |
2012.02.14 |
申请号 |
US201113107476 |
申请日期 |
2011.05.13 |
申请人 |
TSENG NAN-HSIN;LEE YUN-HAN;LIU CHIN-CHOU;CHEN JI-JAN;CHANGCHIEN WEI-PIN;CHEN CHIEN-HUI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
TSENG NAN-HSIN;LEE YUN-HAN;LIU CHIN-CHOU;CHEN JI-JAN;CHANGCHIEN WEI-PIN;CHEN CHIEN-HUI |
分类号 |
B23K31/02;B23K31/12 |
主分类号 |
B23K31/02 |
代理机构 |
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地址 |
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