Epoxy resin composition for sealing semiconductor element,申请号KR20040117759-传众专利搜索

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发明名称	Epoxy resin composition for sealing semiconductor element
摘要
申请公布号	KR101112043(B1)	申请公布日期	2012.02.13
申请号	KR20040117759	申请日期	2004.12.31
申请人		发明人
分类号	C08K3/36;C08L63/00	主分类号	C08K3/36
代理机构		代理人
主权项
地址

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