ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting device which enables an opening hole of a release film to be easily communicated with and disposed to a suction hole of a bonding tool and a tact time to be shortened.

SOLUTION: The electronic component mounting device comprises: a bonding tool 10 having a suction hole 10a for suctioning an electronic component 40 through a long-sized release film 30 conveyed; and a punching mechanism 20 provided at the position of a conveyance path in a stage before the release film 30 is disposed to the bonding tool 10 and for forming an opening hole 30a communicating with the suction hole 10a of the bonding tool 10 in the release film 30. The release film 30 is conveyed to the bonding tool 10 at a required conveying pitch after the punching mechanism 20 forms the opening hole 30a, and the opening hole 30a of the release film 30 is communicated with the suction hole 10a of the bonding tool 10.

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