| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting machine capable of suppressing an increase in total time required for the delivery operation of multiple wafer components. <P>SOLUTION: A mounting machine 100 comprises: two wafer heads 6a and 6b which attract wafer components, and which are vertically reversible; and a head unit 41 having two component mounting heads 41a which receive the wafer components from the two wafer heads 6a and 6b, and which mount the wafer components on a printed circuit board P. The two component mounting heads 41a can simultaneously receive the wafer components attracted by the two wafer heads 6a and 6b, respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
