TAPE FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a tape for wafer processing capable of improving a parting property of an adhesive film and a wafer by expanding and shrinking flexion by expanding.

SOLUTION: The tape 1 for wafer processing has a base film 11 and an adhesive layer 12. The tape is used when a wafer W adhered on the adhesive layer 12 is parted corresponding to respective chips C by expanding, or when the adhesive film 13 adhered on the adhesive layer 12 and/or the wafer W adhered on the adhesive film 13 are parted corresponding to the respective chips C by expanding. The tape 1 for wafer processing is shrunk by heating after expanding. The tape has an elongation percentage of 200% or more, and has an elongation percentage of 120% or less by being heated to 120°C after elongated to the elongation percentage of 200%.

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