LAMINATED INTERCONNECT HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a laminated interconnect heat sink including an integrated circuit and a heat spreader that can effectively dissipate heat.

SOLUTION: An electronic device 100 includes an integrated circuit 103 and a heat spreader 160. The integrated circuit 103 includes a substrate 139 with an active via 151 located therein. The heat spreader 160 includes a thermally conductive core 163. The active via 151 is connected to a corresponding heat spreader via 220 that passes through the thermally conductive core 163.

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