| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a SAW filter device 3 to be shielded from outside (sealed), using lead-free solder. <P>SOLUTION: A prescribed number of SAW filter devices 3 are fixed to a ceramic substrate 2 having an electrode portion 2a formed at a prescribed position. A prescribed number of opening holes 5a exposing the fixed SAW filter devices 3 are provided. A solder foil 5 composed of Bi-Sn solder is formed on the ceramic substrate 2. A cap having an opening downward covers the SAW filter device 3 exposed from the opening hole 5a. While pressure is applied to the cap toward the ceramic substrate 2, the cap is heated at a temperature at which the solder foil 5 is melted, or higher. By this, the melted solder foil 5 is concentrated to the electrode portion 2a formed on the ceramic substrate 2, so that the sealing is achievable by fastening the ceramic substrate 2 and the cap together. <P>COPYRIGHT: (C)2012,JPO&INPIT |
