| 摘要 |
<P>PROBLEM TO BE SOLVED: To propose a method for bonding between at least two substrates formed of a semiconductor material and to overcome the problem with the conventional techniques. <P>SOLUTION: A method for bonding between at least two substrates 1, 2 comprises deposition of at least one drop 8 of liquid adhesive on one of the two substrates and bringing the two substrates into contact causing spreading of the liquid adhesive followed by formation of a solidified adhesive layer between the two substrates. One of the two substrates is further provided, at the surface thereof, with at least one salient rim 3 in which at least one slit is formed, designed to remove the excess liquid adhesive when the two substrates are brought into contact. Finally, the volume of liquid adhesive deposited on one of the two substrates is greater than the volume of the bonding space delineated by the rim between the contacted substrates, and the deposited drop of liquid adhesive presents a strictly greater height H2 than the height H1 of the rim. <P>COPYRIGHT: (C)2012,JPO&INPIT |
