| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of simplifying a manufacturing process by providing a holding mechanism for positioning and holding to a package on a lid, and a method for manufacturing the piezoelectric device. <P>SOLUTION: The piezoelectric device 100 comprises a package 20 having a rectangular bottom surface accommodating a piezoelectric vibration piece 30, a wall upwardly extending from four sides of the bottom surface and a bonded surface of an end face of the wall; and a metallic lid 10 having four sides having a size equivalent to outer periphery of the bonded surface and a locking part extending from at least a part of opposing pair of sides to outer surface of the wall. The locking part 11 is formed by being bent from a position where each of four sides is notched inside by the thickness of the metallic lid, and the bonded surface of the package and four sides of the metallic lid are seam-welded with a wax material 42. <P>COPYRIGHT: (C)2012,JPO&INPIT |
