发明名称 Phase Change Random Access Memory And Fabricating The Same
摘要 <p>PURPOSE: A phase change memory apparatus and a manufacturing method thereof are provided to increase area touched to a lower electrode by etching a part of an ohmic contact layer in order to form into a recess structure. CONSTITUTION: A second interlayer insulating film(125) which exposes a part of an ohmic contact pattern is arranged. An ohmic contact layer which has a recess structure is formed by eliminating the part of the ohmic contact pattern. A heating electrode(130) is arranged along the recess structure and a sidewall of the second interlayer insulating film. A third interlayer insulating film(140) is buried between the heating electrodes. A phase change structure line is formed in order to be extended in a vertical direction with respect to an active region(110).</p>
申请公布号 KR20120012095(A) 申请公布日期 2012.02.09
申请号 KR20100074018 申请日期 2010.07.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 SHIN, HEE SEUNG;PARK, WOONG JIN
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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