发明名称 |
Phase Change Random Access Memory And Fabricating The Same |
摘要 |
<p>PURPOSE: A phase change memory apparatus and a manufacturing method thereof are provided to increase area touched to a lower electrode by etching a part of an ohmic contact layer in order to form into a recess structure. CONSTITUTION: A second interlayer insulating film(125) which exposes a part of an ohmic contact pattern is arranged. An ohmic contact layer which has a recess structure is formed by eliminating the part of the ohmic contact pattern. A heating electrode(130) is arranged along the recess structure and a sidewall of the second interlayer insulating film. A third interlayer insulating film(140) is buried between the heating electrodes. A phase change structure line is formed in order to be extended in a vertical direction with respect to an active region(110).</p> |
申请公布号 |
KR20120012095(A) |
申请公布日期 |
2012.02.09 |
申请号 |
KR20100074018 |
申请日期 |
2010.07.30 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
SHIN, HEE SEUNG;PARK, WOONG JIN |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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