| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emission module that can suppress rapid reduction of frequency response characteristics of an LD driving circuit, and a chip part mounting member. <P>SOLUTION: A light emission module 1 has an LD 16, an FBI 43, a laminate ceramic package 2, and a chip part mounting member 60. The laminate ceramic package 2 contains the LD 16 and the FBI 43 therein, and has a ground pattern along its bottom surface. The chip part mounting member 60 is mounted on the bottom surface of the laminate ceramic package 2. The chip part mounting member 60 has an insulating member 61 having an upper surface and a side surface, and pads 62, 63 formed on from the upper surface of the insulating member 61 to the side surface of the insulating member 61. The electrodes 43a, 43b of the FBI 43 are conductively joined to the pads 62, 63 on the side surface respectively, and bonding wires 57, 58 are conductively joined to the pads 62, 63 on the upper surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
