发明名称 LASER BEAM PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam processing device which can set a processing diameter in a constant size. <P>SOLUTION: The laser beam processing device comprises: a wavelength conversion element 4 which converts fundamental wave laser light 2 into harmonic laser light, and outputs it as a converted beam 5; a capacitor lens 9 which condenses the converted beam 5 as a processing beam 10; a memory 18 in which an initial set temperature of the wavelength sensing element 4 and a set beam diameter of the processing beam 10 are accommodated; a light quantity detector 11 which detects a part of the converted beam 5 as light amount information 12; an irradiation time measure 13 which measures an irradiation time of the converted beam 5, and measures irradiation time information 15; a beam diameter prediction device 19 which calculates a predicted beam diameter of the processing beam 10 from the light quantity information 12 and the irradiation time information 15; and a temperature adjuster 40 which calculates a beam diameter adjustment temperature corresponding to a difference between a predicted beam diameter calculated by the beam diameter prediction means 19 and a set beam diameter accommodated in the memory 18, and adjusts a temperature of the wavelength sensing element 4 so that it reaches the beam diameter adjustment temperature. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012024829(A) 申请公布日期 2012.02.09
申请号 JP20100167973 申请日期 2010.07.27
申请人 PANASONIC CORP 发明人 MOMOI TAKAMITSU;KAMIBEPPU TAKESHI
分类号 B23K26/073;B23K26/00;B23K26/06;G02F1/37;H01S3/00 主分类号 B23K26/073
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