发明名称 |
PRE-ENCAPSULATED CAVITY INTERPOSER |
摘要 |
Methods of forming pre-encapsulated frames comprise flowing a dielectric encapsulation material around at least one conductive trace. A cavity configured to receive at least one semiconductor device at least partially in the cavity is formed in the encapsulation material. A first connection area of the at least one trace is exposed within the cavity. At least another connection area of the at least one trace is exposed laterally adjacent to the cavity. The dielectric encapsulation material is hardened to form a pre-encapsulated frame.
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申请公布号 |
US2012034740(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201113277988 |
申请日期 |
2011.10.20 |
申请人 |
YEAN TAY WUU;AI-CHIE WANG;MICRON TECHNOLOGY, INC. |
发明人 |
YEAN TAY WUU;AI-CHIE WANG |
分类号 |
H01L21/56;B05D5/12 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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