| 摘要 |
An electronic component mounting device having high productivity while enhancing the electromagnetic shielding effect, and a method for manufacturing the same, including a housing formed by a conductive metal material and electronic components to be mounted inside the housing. The housing is configured by a first box body and a second box body fixed so that respective openings face each other and has a conductive layer stacked through an insulating layer arranged on an outer side of the first box body. The first box body includes a through-hole for retrieving a conductive wire connected to the electronic component to the conductive layer, and the through-hole is arranged at a position covered by the conductive layer.
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