| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits displacement of a semiconductor chip when bonding the semiconductor chip, and a manufacturing method of the same. <P>SOLUTION: In the semiconductor device, a first metal electrode 10a is metal bonded with a first external electrode 20 and a second metal electrode 10b is metal bonded with a second external electrode 30 by application of a load and ultrasonic waves to the first external electrode 20. The maximum static friction force between the first external electrode 20 and the first metal electrode 10a is made smaller than the maximum static friction force between the second external electrode 30 and the second metal electrode 10b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
