| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment and a semiconductor manufacturing method, capable of reducing or effectively removing deposited substances in a reaction chamber without lowering productivity to improve a yield. <P>SOLUTION: Semiconductor manufacturing equipment includes: a reaction chamber 11 in which film deposition treatment is subjected to a wafer w; a process gas supply mechanism 12 provided in an upper part of the reaction chamber 11, for introducing a process gas into the reaction chamber 11; a gas discharging mechanism 13 provided in a lower part of the reaction chamber 11, for discharging a gas from the reaction chamber 11; a support member for supporting the wafer w; a cleaning gas supply mechanism 22 provided in an outer periphery of the support member 15, for ejecting a cleaning gas into a space below an upper end of the support member 15 and in an outer circumferential direction of the support member 15; heaters 18a and 18b for heating the wafer w; and a rotating drive control mechanism 17 for rotating the wafer w. <P>COPYRIGHT: (C)2012,JPO&INPIT |
