| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate dissipation of heat generated from an element. <P>SOLUTION: The module comprises a substrate (401) having a surface (402) on which wiring (405) is formed, a surface (403) on the opposite side of the surface (402), and a through hole (404), a heat conduction part (422) buried in the through hole, an electrical conduction part (424) having an overhang part (424a) which covers at least a part of the surface of the heat conduction part on the same side as the surface of the substrate on the opposite side and can touch the surface of the substrate on the opposite side, and being connected electrically with the wiring from the surface of the substrate on the opposite side, and an element (430) mounted on the heat conduction part on the surface side of the substrate and connected electrically with the electrical conduction part via the heat conduction part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
