| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simply structured and simply operable thermal expansion measuring apparatus capable of measuring thermal expansion of a resin material or a molded resin product of any size, thickness, shape and rigidity or a molded resin product in a bent or flexural state under a condition close to a real product. <P>SOLUTION: A thermal expansion measuring apparatus is provided with a support 2 for supporting one end of a test piece 7 (object of measurement) on a test piece mounting table 1, a non-contact type eddy current type displacement gauge 4 installed at the other side end of the test piece than the side end of the test piece supported by the support on the mounting table without contact with the test piece and a measuring jig 3, a heating/cooling tank 5 for heating or cooling the test piece and measuring the temperature of the test piece, and a measuring and stating device 6 for measuring and stating the distance between the non-contact type eddy current type displacement gauge and the measuring jig. <P>COPYRIGHT: (C)2012,JPO&INPIT |
