| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which increases freedom in routing of a low-current wiring part. <P>SOLUTION: The semiconductor device comprises an insulation base material, a wiring part provided at the insulation base material and a semiconductor chip 30 in which a power transistor is formed and sealed in the insulation base material. The wiring part is provided with a high-current wiring part (an emitter terminal 41, a collector terminal 42, an interlayer connection part 60) including a conductor layer electrically connected to high-current electrodes (an emitter electrode 32, a collector electrode 33) of the semiconductor chip 30 and facing the high-current electrodes, and a low-current wiring part including a conductor pattern 50 electrically connected to a low-current electrodes (sensor electrodes 361, 362, a gate electrode) of the semiconductor chip 30 and insulated from the high-current wiring part by the insulation base material and the interlayer connection part 60. <P>COPYRIGHT: (C)2012,JPO&INPIT |
