| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-sealed substrate device with a small substrate inclination. <P>SOLUTION: In a resin-sealed substrate device, an electronic part 3b mounted on the lower side of a substrate 2 is covered, and resin portions 5 are arranged on both surface sides of the substrate 2. The resin-sealed substrate device is also provided with an auxiliary plate 6 provided on the lower side of the resin portion 5, and spacers 7 each of which has one end fixed to the auxiliary plate 6 and the other end fixed to the substrate 2 and is embedded in the resin portion 5. The height of the spacers 7 is set to be higher than that of the electronic part 3b mounted on the lower side of the substrate 2. Consequently, the position of the substrate 2 can be maintained stably by simply mounting the auxiliary plate 6 in a mold during a resin portion formation process 12 because the auxiliary plate 6 is connected to the substrate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
