| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning device which efficiently removes protrusions lying on a back surface of a wafer and to provide a cleaning method. <P>SOLUTION: A cleaning device includes a holding part which holds a semiconductor wafer, a removal part which has an end part harder than a constituent material of a surface layer on a back surface of the semiconductor wafer and is used for cleaning the back surface of the semiconductor wafer that is a processed surface held by the holding part, a moving mechanism which relatively moves the removal part and the semiconductor wafer in a direction parallel to the back surface of the semiconductor wafer, and a control part controlling the moving mechanism. The moving mechanism relatively moves the removal part and the semiconductor wafer in a direction parallel to the back surface of the semiconductor wafer with the removal part spaced away from the back surface of the semiconductor wafer. Then, the end part of the removal part comes into contact with a protrusion made of the same material as the surface layer on the back surface of the semiconductor wafer to grind and remove the first protrusion. <P>COPYRIGHT: (C)2012,JPO&INPIT |
