| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a preferable structure of a BPF and a mounting substrate for loading it, and to provide excellent characteristics even when the height of a BPF chip is lowered. <P>SOLUTION: A band-pass filter module includes a mounting substrate capable of loading a BPF chip on a surface, and the BPF chip loaded on the surface. The BPF chip includes resonators in three or more stages, an intermediate stage resonator connected between an initial stage resonator closest to an input terminal and a final stage resonator closest to an output terminal is disposed at a chip center part, and for a region of the mounting substrate to be overlapped with the chip center part in the view from a plane, a ground non-arrangement part where a ground electrode is not arranged is provided at least from the surface of the mounting substrate to a depth position at which an internal wiring layer that is a top layer among one or more internal wiring layers is arranged. Thus, coupling of the intermediate stage resonator and the ground electrode of the mounting substrate is prevented, the decline of Q of the intermediate stage resonator is prevented, and the increase of insertion loss is prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT |
