| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer box capable of inhibiting wafer from being contaminated by foreign matter produced from vibrations during transportation, by enhancing wafer gripping capacity during the transportation, without deteriorating wafer storage and take-out performance. <P>SOLUTION: The wafer box 11 includes a wafer cassette 13 having both side surfaces formed with a plurality of slit grooves 17 for holding a plurality of spaced-apart semiconductor wafers 12, and a case 14 for housing the wafer cassette 13 holding the semiconductor wafers 12. The wafer box also includes the wafer cassette 13 formed in such a shape that a spacing between both side surfaces is narrower than the outside diameter of the semiconductor wafer 12 and holding the semiconductor wafer 12 while protruding both radial ends 18 of the semiconductor wafer 12 from the slit groove 17, and a pair of airbags 19 inserted between both side surfaces and the case 14 and gripping both radial ends 18 of the semiconductor wafer together with the wafer cassette 13 by being expanded by injection of air G. <P>COPYRIGHT: (C)2012,JPO&INPIT |
