发明名称 HEAT STORAGE BOARD AND TEMPERATURE CONDITIONING PANEL
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat storage board that can be easily manufactured and can reduce a manufacturing cost and that has high rigidity in the thickness direction around a groove part, and provide a temperature conditioning panel using the heat storage board. <P>SOLUTION: The heat storage board 1 includes a heat storage material 3 filled in a shell 2 configuring a board shell. The shell 2 has a board shape having first and second main plate faces 4, 5 and side end faces 6. The first main plate face 4 includes a pipe storage groove 7. A recessed hole 8 is provided from a bottom face of the pipe storage groove 7 to reach the second main plate face 5. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012026597(A) 申请公布日期 2012.02.09
申请号 JP20100163025 申请日期 2010.07.20
申请人 MITSUBISHI PLASTICS INC;KYORAKU CO LTD 发明人 HISAIE TAKESHI;MATSUBARA NORIMUNE
分类号 F24D3/16 主分类号 F24D3/16
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