发明名称 SPUTTERING TARGET, Ag ALLOY FILM AND CONDUCTIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a sputtering target capable of forming a silver based thin film achieving both of excellent corrosion resistance of an Ag alloy film used for a laminated transparent conductor and high light transmittance and excellent conductivity of the laminated transparent conductor.SOLUTION: The sputtering target includes 0.5-1.5 at% of Nb, 0.5-1.5 at% of at least one element selected from Pt and Pd and 90 at% or more of Ag as the remainder, and the total content of Nb, Pt and Pd is 1.0-2.5 at%.SELECTED DRAWING: None
申请公布号 JP2016113686(A) 申请公布日期 2016.06.23
申请号 JP20140255116 申请日期 2014.12.17
申请人 TDK CORP 发明人 KIUCHI KENICHI;KAWAGUCHI YUKIO;IINO MINORU
分类号 C23C14/34;C22C5/06;C23C14/06;C23C14/14;H01B5/02 主分类号 C23C14/34
代理机构 代理人
主权项
地址