发明名称 |
SPUTTERING TARGET, Ag ALLOY FILM AND CONDUCTIVE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target capable of forming a silver based thin film achieving both of excellent corrosion resistance of an Ag alloy film used for a laminated transparent conductor and high light transmittance and excellent conductivity of the laminated transparent conductor.SOLUTION: The sputtering target includes 0.5-1.5 at% of Nb, 0.5-1.5 at% of at least one element selected from Pt and Pd and 90 at% or more of Ag as the remainder, and the total content of Nb, Pt and Pd is 1.0-2.5 at%.SELECTED DRAWING: None |
申请公布号 |
JP2016113686(A) |
申请公布日期 |
2016.06.23 |
申请号 |
JP20140255116 |
申请日期 |
2014.12.17 |
申请人 |
TDK CORP |
发明人 |
KIUCHI KENICHI;KAWAGUCHI YUKIO;IINO MINORU |
分类号 |
C23C14/34;C22C5/06;C23C14/06;C23C14/14;H01B5/02 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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