| 发明名称 | Heat sinking | ||
| 摘要 | A printed circuit assembly includes a printed circuit board, a heat generating component attached to the printed circuit board at a first location, a formed conductive substrate including a protrusion extending toward the printed circuit board corresponding to the heat generating component, and a thermally conductive pad disposed between the printed circuit board and the protrusion of the formed substrate. The formed conductive substrate is configured to flex the protrusion to relieve stress at the heat generating component attachment. | ||
| 申请公布号 | US9386725(B2) | 申请公布日期 | 2016.07.05 |
| 申请号 | US201113224010 | 申请日期 | 2011.09.01 |
| 申请人 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 发明人 | Jensen Clinton;Rothenbuhler Dan;Boice Linden M |
| 分类号 | H05K7/20;H01L23/36 | 主分类号 | H05K7/20 |
| 代理机构 | Dicke Billig & Czaja PLLC | 代理人 | Dicke Billig & Czaja PLLC |
| 主权项 | 1. A printed circuit assembly, comprising: a printed circuit board having a first face and a second face opposite the first face; a heat generating component attached to the first face of the printed circuit board at a first location; a formed conductive substrate including a flexing structure and a protrusion, wherein the protrusion extends toward the second face of the printed circuit board corresponding to the heat generating component; and a thermally conductive pad disposed between and contacting the second face of the printed circuit board and the protrusion of the formed conductive substrate, wherein the flexing structure on the formed conductive substrate is configured to flex the protrusion to relieve stress at the heat generating component attachment. | ||
| 地址 | Houston TX US | ||