| 摘要 |
PURPOSE: A mold for manufacturing a semiconductor package and a method for molding a semiconductor package are provided to prevent a void between a semiconductor chip and a printed circuit board by separately controlling the speed or volume of molding compound resin which is discharged from each gate to a molding area. CONSTITUTION: An air vent hole(30) is formed in the outlet of a cavity. A plurality of gates are connected to the cavity in a mold and are formed with a constant space. The cavity is filled with molding compound resin(16) via gates. A first gate(28a) corresponds to the center of a flip chip connection space between a semiconductor chip and a substrate. A second gate and a third gate are located on either side of the first gate and correspond to a frame of the flip chip connection space. A fourth gate(28d) and a fifth gate(28e) correspond to a peripheral area of the semiconductor chip exiting the flip chip connection space. |
