发明名称 |
Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof |
摘要 |
A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5. |
申请公布号 |
US8110437(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20050514461 |
申请日期 |
2005.05.20 |
申请人 |
WAITL GUNTER;BOGNER GEORG;HIEGLER MICHAEL;WINTER MATTHIAS;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
WAITL GUNTER;BOGNER GEORG;HIEGLER MICHAEL;WINTER MATTHIAS |
分类号 |
H01L21/00;H01L21/52;H01L21/60;H01L23/08;H01L33/62 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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