| 摘要 |
PURPOSE: A semiconductor apparatus is provided to effectively diffuse heat generated from the operation of a semiconductor device to the inside of an encapsulation member, thereby improving heat dissipation properties of the semiconductor apparatus. CONSTITUTION: A semiconductor device(103) is mounted on a substrate(101) through an adhesive material(102B). A heat dissipation member(107) is attached on the semiconductor device through the adhesive material. A thermal interface material, lubricating oil, or a paste is used as the adhesive material. The heat dissipation member is comprised of a single member or a plurality of laminated members. The upper part of the substrate, the semiconductor device, and the heat dissipation member are coated by an encapsulation member(105). |
