LED package and light emitting device has the package and manufacturing method the light emitting device

摘要

PURPOSE: An LED package, a light emitting device using an LED package, and a method for manufacturing a light emitting device are provided to mount an LED package of the same shape on one substrate at various coverage angles by using a jig which supports a part of a floor side of an LED package through a hole at a predetermined height. CONSTITUTION: A first power terminal(120) and a second power terminal(130) is extended from an inner side of a housing(110) to the outside and supplies an external power source. The first power terminal and the second power terminal are exposed from the same side of the housing to the outside. An LED chip(150) is bonded to the second power terminal with a wire(140). A jig insertion part(160) is prepared on a floor side(112) of the housing. A shape of the jig insertion part is matched with the shape of an applied soldering jig.