SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

摘要

PURPOSE: A system for constructing a chip package and a constructing method thereof are provided to expose a clean front side of a die while protecting the die from contamination by using a removable shielding device separated from the die with an air pocket. CONSTITUTION: An opening is formed in a center of a base redistribution layer(16). A bonding layer(24) is spread in one side of the redistribution layer. A window(26) is formed inside the bonding layer. A die(12) includes a front surface which is attached to the base redistribution layer with the bonding layer. A shielding device(20) is placed between the base redistribution layer and the bonding layer.