| 摘要 |
PURPOSE: An apparatus for stripping an electronic component and a stripping method thereof are provided to improve analysis precision in a solder joint portion by stripping an electronic component without generating ductile fracture in the solder joint portion. CONSTITUTION: A stripping apparatus(10) stripped an electronic component(12) from a substrate(11). The electronic component is a package in which a plurality of solder bumps(13) is arranged in one side of a resin sealing part(12a) as a solder joint portion. The stripping apparatus includes a fixing part(1), a grip part(2), a conveying part(3), a supporting part(4), and an impact force applying part(5). The fixing unit fixes a substrate for a work table(9). The grip part grips an electronic component on the substrate which is fixed to the fixing part. The conveying part has a lever part(3a) and a pillar part(3b). The grip part is attachably and detachably fixed to/from the lever part. The supporting part supports the pillar part over the work table through a rotary shaft(4a) to be shaken. The impact force applying part applies an external force to the conveying part. |
