| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device including a testing circuit formed on a wafer to perform a radio test of a wafer having an integrated circuit and a method. <P>SOLUTION: A device comprises a testing unit 12 disposed outside of a wafer 16 and at least one testing circuit 14 formed on the wafer including an integrated circuit. The testing unit 12 transmits an RF signal and supply electric power to the testing circuit 14. The testing circuit 14 includes a variable ring oscillator, performs a series of parameter tests at a nominal operation frequency of the integrated circuit, and transmitting a test result to the testing unit 12 for analysis. <P>COPYRIGHT: (C)2012,JPO&INPIT |
