LASER PROCESSING APPARATUS, PROCESSING METHOD FOR A WORKPIECE, AND DIVIDING METHOD FOR A WORKPIECE

摘要

PURPOSE: A laser processing apparatus, a processing method of a workpiece and a dividing method of a workpiece are provided to improve the light emitting efficiency of a light emitting element by forming recess parts on the divided cross section of a transparent substrate. CONSTITUTION: A laser processing apparatus comprises a light source, a standing board, and a stress applying unit. The light source emits pulse laser beams. An object is placed on the standing board. The stress applying unit applies tensile stress to the object placed on the standing board. The pulse laser beams irradiated to the object are dispersed by moving the standing board.