| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding method in which ball bonding is performed as primary bonding and stitch bonding is performed as secondary bonding, for enabling the formation of an appropriate initial ball though a wire drawn in a wire drawing step after the secondary bonding bends to a level of discharge disabled. <P>SOLUTION: The wire bonding method, when forming a initial ball 41 after a wire draw step, comprises the steps of: performing discharge on a drawn wire 40; detecting, based on the discharged state, whether the drawn wire 40 is bending with respect to a virtual line S extending along a direction in which an inner hole 101 of a capillary 100 extends; reforming the bending of the wire, if the bending state is detected, to the state where the wire 40 extends along the direction same with that of the virtual line S; and subsequently performing discharge again to form the initial ball 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
