发明名称 |
WATER RESISTANT SURFACE MOUNT DEVICE PACKAGE |
摘要 |
<p>LED packages (10) and LED displays utilize water resistant packages with improved structural integrity and customizable attributes. The improved structural integrity is provided by various features in the lead frame (14) that the casing (12) material encompasses to improve the adhesion between the lead frame (14) and the casing (12) for a stronger, water resistant package (10). Moreover, the improved structural integrity and water resistance is further provided by cavity (40) features that improve adhesion between the cavity (40) and a protective encapsulant. Packages (10) with a greater overall height than the length of their side-exposed solder pins are provided, which improves gel coverage of the side-exposed solder pins between adjacent packages (10).</p> |
申请公布号 |
WO2012013161(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
WO2011CN77823 |
申请日期 |
2011.07.29 |
申请人 |
CREE HONG KONG LIMITED;CHAN, ALEX CHI KEUNG;PANG, CHARLES CHAK HAU |
发明人 |
CHAN, ALEX CHI KEUNG;PANG, CHARLES CHAK HAU |
分类号 |
H01L33/62;H01L23/495;H01L33/48 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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