| 摘要 |
The present invention relates to a laser scriber including: a back and forth moving device installed at a table and including an adsorbing tool having a detection hole for arrangement to adsorb and fix a wafer cell, and a location correction tool arranging the wafer cell through a rotating control of the adsorbing tool; a detecting device installed at the table for detecting an arranged state of the wafer cell through the detection hole of the adsorbing tool; and a laser radiation device installed at the table to be disposed at an upper side of the back and forth moving device for performing a scribing process on a surface of the wafer moving back and forth in an arranged state. The wafer cell is arranged by the rotating control of the location correction tool according to detection of the detecting device, and then the wafer cell is moved to a lower part of the laser radiation device through the back and forth moving device, so that the scribing process using the laser radiation device is achieved. |
