| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve solder solubility resistance to a high melting point solder. <P>SOLUTION: A conductive paste according to the present invention contains: (A) conductive powder; (B) glass frit containing 85 wt.% or more in total of a constituent comprising the following composition in oxide equivalent and substantially containing no lead; and (C) an organic vehicle. The composition as the percentage in the glass frit is as follows: SiO<SB POS="POST">2</SB>...16-47 wt.%; Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>...33-52 wt.%; MgO...3-15 wt.%; and B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>...15-45 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
