发明名称 |
COMPOSITE SUBSTRATE, ELECTRONIC COMPONENT, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT |
摘要 |
<p>[Problem] Provided are: a composite substrate which comprises a silicon substrate having excellent crystallinity; a method for producing a composite substrate; and a method for manufacturing a semiconductor element. [Solution] A composite substrate (1) is obtained by bonding a semiconductor substrate (20) on an electrically insulating supporting substrate (10). The semiconductor substrate (20) is formed of silicon. The semiconductor substrate (20) comprises a plurality of first regions (20x), in each of which an element portion functioning as a semiconductor element is formed, and a second region (20y) which is located between the first regions (20x). The semiconductor substrate (20) is provided with an oxidized portion (22) in a lower main surface (20b) of the second region (20y), said oxidized portion (22) being formed of silicon oxide.</p> |
申请公布号 |
WO2012015022(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
WO2011JP67385 |
申请日期 |
2011.07.29 |
申请人 |
KYOCERA CORPORATION;KITADA, MASANOBU |
发明人 |
KITADA, MASANOBU |
分类号 |
H01L27/12;H01L21/02;H01L21/762 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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