| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing sheet which can be kept in a state of only a sheet itself free of influence from ultraviolet rays without using a packing bag for keeping though an adhesive layer of an ultraviolet cure self-adhesive film is included. <P>SOLUTION: The wafer processing sheet 1 to be rolled comprises a peeling film 2, an adhesive layer 3 formed on the peeling film 2, and a self-adhesive film 4 formed on the adhesive layer 3 with an adhesive force between the adhesive layer 3 and the self-adhesive film 4 decreased by ultraviolet radiation. At an edge portion of the peeling film 2, an ultraviolet ray shielding film 5 for shielding 90% and over of ultraviolet rays having a wavelength of 300-400 nm is provided to cover an entire area of a film face exposed to the outside when rolled. <P>COPYRIGHT: (C)2012,JPO&INPIT |
