| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip mounting device capable of performing an inclination correction more quickly to a wafer to which a target mark is not applied. <P>SOLUTION: An image processing part 610 calculates a coordinate value of a reference point of a semiconductor chip for one line (horizontal row). An inclination detecting part 620 obtains an approximation straight line of the reference point whose coordinate value is calculated to obtain an inclination of the approximation straight line. A drive controlling part 630 rotates a chip loading part 50 to perform the inclination correction based on the inclination obtained by the inclination detecting part 620. The inclination correction is performed by obtaining the coordinate value of the reference point, therefore, the inclination correction can be performed for a wafer to which a target mark is not applied as well. Moreover, one inclination correction is sufficient for the reference point of the semiconductor chip for one line, thereby the inclination correction can be performed more quickly. <P>COPYRIGHT: (C)2012,JPO&INPIT |
