发明名称 THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE AND ADHESIVE SHEET CONTAINING THE SAME
摘要 <p>PURPOSE: Provided are heat-conductive and pressure-sensitive adhesives and adhesive sheets in the form of sheets, tapes, etc. wherein the heat-conductive and pressure-sensitive adhesives are located on heat-conductive base materials. CONSTITUTION: An adhesive sheet (2) is interposed between an electronic part (1) and a heat-radiating member (3). The sheet (2) comprises a thermally conductive substrate (21) and, disposed respectively on both sides thereof, layers(22 and 23) of a thermally conductive pressure-sensitive adhesive comprising: (a) 100 parts by weight of a copolymer of a monomer mixture comprising 100 parts by weight of main monomers consisting mainly of alkyl (meth)acrylates in which the alkyls each has 2 to 14 carbon atoms on average and 1 to 30 parts by weight of a polar monomer giving a homopolymer having a glass transition point of 0°C or lower; and (b) 10 to 300 parts by weight of a thermally conductive filler. Thus, the part (1) is bonded to the member(3) with the layers (22 and 23) while attaining satisfactory thermal conduction therebetween.</p>
申请公布号 KR20000057297(A) 申请公布日期 2000.09.15
申请号 KR19997004722 申请日期 1999.05.28
申请人 NITTO DENKO CORPORATION 发明人 MUTA, SHIGEKI;OHURA, MASAHIRO;YOSHIKAWA, TAKAO
分类号 C08L33/06;C09J7/02;C09J9/00;C09J133/06;(IPC1-7):C09J133/06 主分类号 C08L33/06
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