发明名称 |
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE |
摘要 |
The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200° C. or more or a metal. |
申请公布号 |
US2012028416(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
US201113191950 |
申请日期 |
2011.07.27 |
申请人 |
TAKAMOTO NAOHIDE;SHIGA GOJI;ASAI FUMITERU;NITTO DENKO CORPORATION |
发明人 |
TAKAMOTO NAOHIDE;SHIGA GOJI;ASAI FUMITERU |
分类号 |
H01L21/78;B32B7/12;B32B27/00 |
主分类号 |
H01L21/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|