| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing method which can easily remove a ring-shaped reinforcement portion without damages from a wafer on which the ring-shaped reinforcement portion having a thickness thicker than that of a device region is formed on a peripheral side of the device region. <P>SOLUTION: The wafer processing method comprises steps of integrating a surface of a wafer W on which a ring-shaped reinforcement part W4 is formed with a frame F1 by sticking the surface to a dicing tape T1, cutting the wafer W as it is at a boundary portion W12 between a device region W1 and the ring-shaped reinforcement portion W4 together with the dicing tape T1 to separate the ring-shaped reinforcement part W4 from the device region W1 and removing the ring-shaped reinforcement part W4 together with the frame F. Since the ring-shaped reinforcement part W4 is removed in a state where the ring-shaped reinforcement part W4 is integrated with the frame F1 via the dicing tape T1, the ring-shaped reinforcement part W4 can be removed in a short time without damaging the ring-shaped reinforcement part W4. Since the ring-shaped reinforcement part W4 is not damaged, the device region W1 is prevented from damages. <P>COPYRIGHT: (C)2012,JPO&INPIT |
