发明名称 Verfahren und Vorrichtung zur Herstellung einer integrierten Röhrenplatte
摘要 An integrated piping plate (1) composed of two or more plates (2,3) joined together, in which an instrument (11,12) and a component constituting an apparatus are disposed, or the instrument (11,12) is disposed, or the component is disposed, on one of or both of surfaces of the integrated piping plate (2,3). Grooves (8) serving as channels for fluids are formed in joining surfaces of the plates (2,3), and the instrument (11,12) and the component are connected, or the instrument (11,12) is connected, or the component is connected, by the grooves (8). The integrated piping plate (1) is provided singly, or a plurality of the integrated piping plates (1) are provided, and a corrosion-proof layer (29) is formed on a surface of each of the grooves (8). With such piping plate (1) an apparatus including the piping plate (1) can be downsized, easily modularized, easily assembled and the risk of fluid leakage is reduced. Further the life of the piping plate (1) can be prolonged. <IMAGE>
申请公布号 DE60225688(T3) 申请公布日期 2012.02.02
申请号 DE2002625688T 申请日期 2002.01.31
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 HIDAKA, HARETARO;TSUKAMOTO, MICHIO
分类号 B23K20/12;B23K1/00;B23K26/36;B23K31/02;F15B13/00;F15B13/08;F15C1/02;F17D1/04;F28F9/02;H01M8/02;H01M8/04;H01M8/24 主分类号 B23K20/12
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